- IC packaging (http://en.wikipedia.org/wiki/Integrated_circuit_packaging). This link has links to further info on Wikipedia about various aspects of semiconductor packaging process.
- http://www.extremetemperatureelectronics.com/index.html Extreme Temperature Electronics
- Electronic packaging (http://en.wikipedia.org/wiki/Electronic_packaging)
- NASA https://nepp.nasa.gov/index.cfm Packaging, Tin Whiskers, Wirebond
- Packaging and related http://privatewww.essex.ac.uk/~bolat/
- Wirebonding http://privatewww.essex.ac.uk/~bolat/Wirebonding.html
- polymerinnovationblog.com Polymers in packaging
- Advanced Materials, manufacturing and Testing Information Analysis Center http://ammtiac.alionscience.com/
- Advanpack http://www.advanpack.com/techLibrary.html articles and papers
- Barringer (Reliability analysis) http://www.barringer1.com/index.shtml Look under handy tools
- BioMEMS resource center http://www.biomemsrc.org/biomems/
- The Defense Technical Information Center http://www.dtic.mil/dtic/ publications on diverse topics
- FlipChipsDotCom http://www.flipchips.com/news.html
- GDf online http://www.semiconductor-technology.com/
- Insights from the Leading Edge http://www.electroiq.com/blogs/insights_from_leading_edge/2012.html Comments on new developments
- Institute of Microelectronics Singapore https://www.ime.a-star.edu.sg/page/research_highlights
- MEMcyclopedia http://memscyclopedia.org/
- MEMX http://www.memx.com/ MEMS
- Minerals, Metals, and Materials Society http://www.tms.org/pubs/journals/JOM/9706/Nakajima-9706.html Kirkendall Effect
- Multicircuits http://www.multicircuits.com/ PCB related design, test and manufacturing information
- National
- http://www.national.com/ms/SE/SEMICONDUCTOR_PACKAGING_ASSEMBLY_TECHNOLOGY-MISC.pdf
- http://www.national.com/en/packaging/literature.html
- http://www.national.com/ms/PA/PACKAGE_RELIABILITY.pdf
- National Technical Information Service http://www.ntis.gov/ Diverse technical information.
- NCBI http://www.ncbi.nlm.nih.gov/ National Center for Biotechnology Information
- Nexus http://www.nexus3c.com/conformal-coating-defects-database
- NIST Publications https://www.nist.gov/publications
- Nordic Electronics Packaging Guideline http://extra.ivf.se/ngl/
- Nordson http://www.nordson.com/en-us/divisions/efd/products/solder-paste/quality-assurance/Pages/white-papers.aspx soldering and dispensing
- PCPlus http://pcplus.techradar.com/2009/05/21/how-silicon-chips-are-made/ How chips are made
- Renesas http://am.renesas.com/products/package/index.jsp PCB design, etc.
- Sabic https://www.sabic-ip.com/staticcxp/user/en/LearnAboutColor/ColorBasicsDetail/basics_of_color.html Color basics
- Silicon Far East http://www.siliconfareast.com/index.html Packaging. Semiconductors. Decapsulation. Delid.
- SMTnet http://www.smtnet.com/library/ Publications on many SMT related topics
- SOA/NASA Astrophysics data system http://www.adsabs.harvard.edu/ Access to technical publications
- Sony http://www.sony.net/Products/SC-HP/tec/catalog/qr.html
- University of Bolton http://www.ami.ac.uk/courses/topics/ Review of electronics related materials and processes. A very good source of information about IC assembly.
- ZyMOS http://how-to.wikia.com/wiki/User:ZyMOS Diverse info
- Best Manufacturing Practices http://www.bmpcoe.org/library/books/index.html Large collection of manufacturing related information
- Cure terms glossary http://polymatrix.co.uk/Cure%20(2).htm
- Electronic packaging and manufacturing in Japan http://www.wtec.org/loyola/ep/toc.htm (report)
- Die attaching (http://en.wikipedia.org/wiki/Die_attaching)
- Wire bonding (http://en.wikipedia.org/wiki/Wire_bonding)
- Thermosonic Bonding (http://en.wikipedia.org/wiki/Thermosonic_Bonding)
- Flip chip (http://en.wikipedia.org/wiki/Flip_chip),
- Quilt packaging (http://en.wikipedia.org/wiki/Quilt_packaging),
- IC encapsulation (http://en.wikipedia.org/wiki/IC_encapsulation), not much detail here
- Baking (http://en.wikipedia.org/wiki/Baking), a general discussion of baking
- Plating (http://en.wikipedia.org/wiki/Plating), general discussion of plating
- Plating (finishing.com)
- Rework wire http://www.preleg.com/
- Stealth dicing https://jp.hamamatsu.com/sd/Index_eg.html
- ASSIST https://assist.daps.dla.mil/online/start/ Military specifications database
- Burn-in (http://en.wikipedia.org/wiki/Burn-in)
- Center for Advanced Life Cycle Engineering, CALCE, http://www.calce.umd.edu/articles/ articles since 1985
- Defense Logistics Agency http://www.dscc.dla.mil/Programs/MilSpec/DocSearch.asp
- DfR Solutions http://www.dfrsolutions.com/thermal-cycling-to-service-life-correlation/ Reliability calculators, e.g., Theral cycling to life correlation. Unit conversion.
- Military drawings and specifications search
- Molecular Expressions http://micro.magnet.fsu.edu/primer/index.html Microscopy
- Material outgassing data http://outgassing.nasa.gov/ (Rush from http://www.accueng.com/ posted link on IPC TechNet forum) Listing of data gathered on a large number of materials.
- NAVSEA Parts requirements includes information on quality, construction and reliability, etc. http://www.navsea.navy.mil/nswc/crane/sd18/default.aspx
- NASA lead free http://teerm.nasa.gov/nasa_dodleadfreeelectronics_proj2.htm
- PhotoMetrics http://www.photometrics.net/ Material Characterization. Field Emission Scanning Electron Microscopy.
- Plastic Package Reliability http://www.slideshare.net/ASQwebinars/plastic-package-reliability
- The Quality Portal http://thequalityportal.com/ Pocket cards http://thequalityportal.com/glossary/rc.pdf
- Screening Systems http://www.scrsys.com/acronyms.html Accelerated Testing Acronyms.
- Temperature cycling (http://en.wikipedia.org/wiki/Temperature_cycling)
- Thermal Shock (http://en.wikipedia.org/wiki/Thermal_shock)
- http://bareboard.com/Tech-Tips.php PCB related info
- http://bareboard.com/PCB-Glossary.php PCB glossary
- http://www.altera.com/technology/signal/board-design-guidelines/sgl-bdg-index.html Design guidelines
- http://www.arlon-med.com/Everything%20You%20Wanted.pdf Everything you always wanted to know about laminates
- http://www.alexwhittemore.com/
- http://www.globalchipmaterials.com/home.htm Ceramic IC packaging materials
- circuitinsight.com
- http://www.pcbunlimited.com/ small stencils for development work
- http://www.surfacemountprocess.com/ SMT process info
PCB Design
- https://omnipcb.wordpress.com/2013/10/04/ipc-and-mil-spec-for-printed-circuit-boards/ lists related MIL and IPC specs. Please see these listings from here under the next heading
- IPC.org Numerous standards
- https://link.springer.com/content/pdf/bbm%3A978-94-011-7003-1%2F1.pdf Mil-Std compilation
- https://ocmmanufacturing.com/resource-type/dfm-tips/ Numerous articles on PCB DfM.
- http://irtfweb.ifa.hawaii.edu/~ao/Electronic/Peter_dump/Electronics/System/Text/PCBCADGuidelines.pdf
- https://www.seeedstudio.com/blog/2017/05/03/pcb-dfm/ PCB DfM articles
- http://www.quick-teck.co.uk/TechArticleDoc/8470599521348049086.pdf
- https://www.autodesk.com/products/eagle/blog/top-10-pcb-component-placement-tips-pcb-beginner/
- https://www.smta.org/chapters/files/arizona-sonora_design_for_manufacturing_-_adan_ortiz.pdf
- https://www.altronmfg.com/pcb-design-for-manufacturability/
- https://www.eurocircuits.com/pcb-design-guidelines/
- https://electronics.stackexchange.com/questions/244475/ipc-specification-for-pad-width-vs-pin-width-smd
- https://www.pcblibraries.com/Forum/ipc7351-smd-pth-reference-calculators_topic785.html
- http://www.pcblibraries.com/FPX/
IPC-SPECS:
- IPC-6013 – Qualification and Performance Specification for Flexible Printed Boards
- IPC-T-50 – Terms and Definition
- IPC-MF-150 – Metal Foil for Printed Wiring Applications
- IPC-FC-231 – Flexible Bare Dielectrics for Use in Flexible Printed Wiring
- IPC-FC-232 – Specification for Adhesive Coated Dielectric Films For Use as Cover Sheets for Flexible Printed Wiring
- IPC-FC-241 – Flexible Metal Clad Dielectrics for use in Fabrication of Flexible Printed Wiring
- IPC-SM-840 – Qualification and Performance of Permanent Solder Mask
- IPC-2221 – Generic Standard on Printed Board Design
- IPC-2223 – Sectional Design Standard for Flexible Printed Boards
- IPC-4101 – Laminate/Prepreg Materials Standard for Printed Boards
- IPC-6011 – Generic Performance Specification for Printed Boards
- IPC-6012 – Qualification and Performance Specification for Rigid Printed Boards
- J-STD-001 – Requirements for Soldered Electrical and Electronics Assemblies
- J-STD- 002 – Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
- J-STD-003 – Solderability Tests for Printed Boards
- J-STD -004 – Requirements for Soldering Fluxes
- J-STD- 005 – General Requirements and Test Methods for Electronic Grade Solder Paste
- J-STD-006 – General Requirements and Test Methods for Soft Solder Alloys and Fluxed and Non-Fluxed Solid Solder for Electronic Soldering Applications
MIL-SPECS
- MIL-P-50884 – Flex Manufacturing and Performance
- MIL-STD-2118 – Flex Design Standard
- MIL-STD-105 – Sampling Procedures and Inspection Tables
- MIL-STD-129 – Marking for Shipment and Storage
- MIL-STD-130 – Identification for Marking
- MIL-STD-202 – Test Methods for Electronic Equipment
- MIL-STD-2000 – Soldering and Assembly
- MIL-STD-45662 – Calibration System Requirements
- DOD-D-1000 – Engineering Drawings
- DOD-STD-100 – Engineering Drawing Practices
- ANSI-Y-145 – Dimensioning and Tolerancing
- MIL-S-13949 – Plastic Sheet, Laminate, Metal Clad (for PWB’s)
- MIL-C-14550 – Copper Plating (Electrodeposited)
- MIL-I-43553 – Ink Marking, Epoxy Base
- MIL-G-45204 – Gold Plating (Electrodeposited)
- MIL-I-45208 – Inspection System Requirements
- MIL-Q-9858 – Quality Program Requirements
- MIL-P-81728 – Plating Tin Lead (Electrodeposited)
- MIL-P-55110 – Printed Wiring Boards
- QQ-N-290 – Nickel Plating (Electrodeposited)
Forums
- IPC TechNet http://www.ipc.org/ContentPage.aspx?pageid=TechNet-E-mail-Forum
- Printed Circuit Board Assembly & PCB Design Forum http://www.smtnet.com/Forums/
- How and where to obtain US government technical publications http://ammtiac.alionscience.com/resources/obtainingdocuments.html
- National Physical Laboratory http://www.npl.co.uk/ Electronic Interconnects. Materials.
- Integrated Electronics Engineering center http://www.ieec.binghamton.edu/ieec/
- Center for Nanoscale Science and Engineering at NDSU http://www.ndsu.edu/cnse/facilities_equipment/prototype_fabrication.html
- http://www.pvresources.com/BIPV/Transparent.aspx General information and listing of commercially available products
- http://www.aliexpress.com/cp/compare-solar-panels-technology.html Commercial products
- http://www.case.rpi.edu/CASE.html CASE
- http://www1.cnsi.ucla.edu/staticpages/facil-it UCLA
- http://articles.latimes.com/2012/jul/24/business/la-fi-tn-transparent-solar-cells-20120724 UCLA news
- http://solartribune.com/2012-08-03-researchers-develop-new-transparent-solar-cell/ UCLA news
- http://info.biotech-calendar.com/bid/89038/Polymer-Solar-Cell-Research-Breakthrough-at-California-NanoSystems-Institute-UCLA UCLA news
- http://www.extremetech.com/extreme/149163-mit-startup-makes-transparent-solar-cells-that-will-allow-your-smartphone-to-power-itself MIT news
- http://venturebeat.com/2013/06/04/these-transparent-solar-cells-provide-50-more-battery-life-for-your-smartphone-and-give-you-infinite-standby-time/ news
- http://www.huffingtonpost.com/2010/03/05/solar-powered-office-wind_n_485374.html news
- http://phys.org/news/2012-08-transparent-solar-cells-windows-electricity.html news
- www.LinkedIn.com
- www.leadferret.com
- www.zoominfo.com
- www.lead411.com
- http://www.peoplebyname.com/ Caller ID and address look-up
- glassdoor.com
- careerbliss.com
- jobs-salary.com
- http://www.eia.gov/ US energy information administration. Source of information on energy in the US.
- http://www.eia.gov/state/maps.cfm?src=home-f3 US energy mapping system. Find energy installations across US.
- http://www.halliburton.com/en-US/ps/sperry/drilling/geosteering-services/gabi-downhole-drilling-motor.page downhole drilling motor
- https://www.dmr.nd.gov/OaGIMS/viewer.htm ND oil and gas locations
- Molecular Expressions Silicon Zoo http://micro.magnet.fsu.edu/creatures/index.html Semiconductor Art
- Chips History Center http://chiphistory.org/index.html
- Smithsonian Chips http://smithsonianchips.si.edu/ Silicon Art, pictures and other archives
- Chip manufacturers' logos http://how-to.wikia.com/wiki/Howto_identify_integrated_circuit_(chip)_manufacturers_by_their_logos
- CERN info https://twiki.cern.ch/twiki/bin/view/DefaultWeb/WebHome for particle physics info just enter the name of the scientist of a term
- http://periodictable.com/ elemental information and properties of materials
