Moisture Absorption wt %
Most of the data is from Electronic Packaging Materials and Their Properties by Pecht, et al.
Acrylic 6
Epoxy 4
Polyimide/polyamide 3
Kevlar-49 0.5-2, 1.1
Polyester <0.8, 2PPA 1.8
Polyvinyl Chloride <0.5
Polycarbonate <0.35
BCB 0.25
Polysulfone <0.22
FR4 0.1
Parylene <0.1
Fluoropolymers 0.1
Cyanate ester 0.08
BT 0.05
Polyvinyl fluoride <0.05
LCP 0.02, 0.04
TFE/FEP/polyethylene <0.01
Polypropylene <0.005
Common substrate material properties
Common substrate material properties
Material
|
Dielectric Constant
|
CTE, ppm/°C
|
Tg, °C
|
% Water Absorption
|
BCB
|
2.65
|
52
|
350
|
0.25
|
Polyimide
|
3.5-4.2
|
10-14
|
250
|
0.35
|
BT
|
4.3
|
15-16
|
180
|
0.05
|
FR-4
|
4.8
|
13-18
|
125
|
0.1
|
Cyanate Ester
|
3.6
|
8-10
|
230
|
0.08
|
Thermal conductivity of select materials
Most of the data is from Electronic Packaging Materials and Their Properties by Pecht, et al.
| Material | Thermal conductivity, k (W/m-°C) |
| Diamond | 2000-2300 |
| Copper | 380 |
| Beryllia | 150-300 |
| SiC | 12-270 |
| Aluminum | 140-220 |
| Aluminum nitride | 82-320 |
| Tungsten | 174-177 |
| Molybdenum | 130-138 |
| Silicon | 124-148 |
| Quartz | 43 |
| Boron nitride | 60 |
| Lead | 36 |
| Sapphire Alumina | 32-35 15-33 |
| Kovar | 15.5-17 (209.3?) |
| Silicone | 6.4-7.5 |
| Polyurethane | 1.9-4.6 |
| Epoxy glass | 0.3 |
| Polyimide | 0.2 |
| Acrylic | 0.2 |
