Abbreviations

AHTS: advanced high temperature superconductor

AMLCD: active-matrix LCD

ASIC: application specific integrated circuit

A-Stage: raw un-reacted (uncured) material
BGA: ball grid array

Bit: a zero or a one

BOC: board over chip
BOM: bill of materials.

B-Stage: partially reacted (cured) material
BT: Bismaleimide-Triazine

BTU: British thermal unit

Byte: A word made from zeroes and ones.

CAD: computer aided design

CDA: clean dry air

CDRL: Contract Data Requirements List

CFD: Complete Factorial Design

CMOS: Complementary Metal Oxide Semiconductor

CNSE: Center for Nanoscale Science and Engineering

COE: Center of Excellence

COTS: commercial off-the-shelf

cSAM: c-mode scanning acoustic microscopy
CSP: chip size package (equal in size to that of the chip), chip scale package (smaller than 1.2x of the size of the chip)

C-Stage: completely reacted (cured) material
CTE: coefficient of thermal expansion

DARPA: Defense Advanced Research Projects Agency

DCP: down-converting phosphor

DFM: Design for manufacturing

DI: de-ionized

DIMM: dual inline memory module

DMA: Dynamic Mechanical Analyzer ()

DMEA: Defense Microelectronics Activity

DoD: Department of Defense

DRAM: dynamic random access memory

DSP: digital signal processing

ECE: electrical and computer engineering

ECN: Engineering Change Notice

E-coat: Electrocoating

EEPROM: Electrically Erasable Programmable Read-Only Memory

EMEG: Electronic Manufacturing Engineering Group

EM Electromagnetic

EMI: Electromagnetic Interference

EOM: Emulsion over (screen) mesh
ESD: electrostatic discharge

FBGA: fine-pitch ball grid array

FPGA: Field Programmable Gate-Array

FC: flip chip

FEA: finite element analysis

FEM: Finite Element Method, Finite Element Model

FSA: Fluidic Self Assembly

Gb: gigabit

GB: gigabyte

GHz: Giga-Hertz, 10⁹ cycles per second

GPS: Global Positioning System

HAP: hazardous air pollutant

HDTV: High Definition Television

HS: heat spreader

HTC: Heat transfer coefficient

HTS: high temperature superconductor

HTST: High temperatures stress test

Hz: Hertz, cycles per second

IC: integrated circuit, electronic chip

IC: intelligence community

ID: inner diameter
IDC: Indirect costs

I/O: input/output

IPA: isopropyl alcohol

IR: infra-red
IT: information technology

JEDEC: Joint Electronic Devices Engineering Council

JTRS: joint tactical radio system

LCD: liquid crystal display

LED: light emitting diode

LGA: land grid array

LNA: low noise amplifier

LOC: lead over chip
LPD: low probability detect

LPI: low probability intercept

LPJ: low probability jam

MAC: media access control

Mb: megabit

MB: megabyte

MEMS: micro-electromechanical system

MLT: multilayer tape

MRAM: magnetoresistive random access memory

MSS: Micro-Sensor System

NDA: non-disclosure agreement
NDT: Non-destructive testing

NRL: Naval Research Laboratory

NSMD: non-solder-mask defined
OD: outer diameter
OEM: original equipment manufacturer

OLED: organic light emitting diode

OTA: over the air (transmission)

PCB: printed circuit board

PCT: pressure cooker test

PDLC: polymer dispersed liquid crystal

PO: purchase order

R&D: research and development

RDL: re-distribution layer
RF: radio frequency

RFIC: radio frequency integrated circuit

RFID: radio frequency ID

RFQ: request for quote

RoHS Directive: The restriction of the use of certain hazardous substances in electrical and electronic equipment

RTP: research technology park

SEG: Sensor Electronics Group

S/HS: (RF) Shield/Heat Spreader

SIM: Subscriber Identity Module (cell phones)

SiP: system in package

SLIM (System-Level-Integration-and-Miniaturization)

SMD: solder-mask defined
SMT: surface mount technology

SOC: system on chip

SO-DIMM: slim outline dual inline memory module

SOI: silicon on insulator

SOW: statement of work

SPICE: Simulation Program With Integrated Circuit Emphasis, Stanford Program for Integrated Circuit Emulation 

SRAM: static random access memory

STTC: Skills and Technology Training Center

TAB: tape automated bonding

TASS: totally agile sensor systems

T/C: temperature cycling

TDC: total direct costs

TDR: Time domain reflectometer

Θ_ja: junction-to-ambient thermal resistance

Θ_jc: junction-to-case thermal resistance

TPA: Tunable Patch Antenna

TSV: through-Si via
T/S: temperature shock

TSOP: thin slim outlines package

UAF: University of Alaska Fairbanks

UCP: up-converting phosphorUV: ultraviolet

VECSEL: Vertical Cavity Surface Emitting Laser

VNA: Vector network analyzer

VLSI: very large scale integration

VOC: volatile organic compound
WLP: wafer level packaging